To address the heat dissipation challenges of upgraded Network Devices (e.g,  Wi-Fi 6/7 routers), Covestro developed a new generation innovative thermal conductive polycarbonate solution.
This solution combines superior flame retardancy, easy molding, and design flexibility, while enabling effective heat dissipation and significanttly lower total costs to achieve enhanced industrial design, and cost-effective mass production.

Meeting Content:
1. Network communication industry trend and challenges
2. Covestro innovative thermal conductive total solution
  3. Case studies

100+ attendees are already asking! Your needs or pain points could be addressed directly by our speakers 
Questions raised by registered audience:
1. In product design, how can thermal conductive materials address the differences in thermal conductivity caused by filler orientation during processing (flow direction vs. vertical direction)? 
2. When using thermal conductive materials in molds, what are the differences in structure/design? How about processability?
3. Do interior surface materials have thermal conductivity functions? Are there relevant technical solutions available?
4. For low-volatility silicone grease: what high thermal conductivity options are available? For example, for a 0.2mm thermal pad, what options achieve 5.0+ W/m·K?
5. Is this material expensive? Compared to conventional materials, what price range does it fall into?
(More questions are being collected…)
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